CIPC

XMS3 DHX Series - Cool DDR3!

Sporting Corsair’s signature fin memory heat sink and patented heat-removing printed circuit board design, the new XMS3 DHX products feature DDR3 performance while promoting increased stability. DHX technology allows this memory to have superior thermal characteristics to enable it to run cooler than a module with stamped or mesh heat spreaders. The result is enabled superior reliability, stability and performance capability.